Printed circuit board manufacturing - build-up boards
It is a method of forming a build-up layer on top of a core substrate.
The precision of printed circuit boards has advanced, and the demand for printed wiring boards using the build-up method has increased. The build-up method is a construction technique that forms build-up layers on top of a core substrate. The connection between the core substrate and the build-up layers is made using laser vias. By using this method, it becomes possible to achieve higher density wiring. Currently, it can accommodate up to 2-layer builds (two layers of build-up layers above and below). Additionally, stack vias and filled vias are also supported. There are also achievements in manufacturing rigid-flex boards and multilayer flex boards using the build-up method. For more details, please contact us or refer to the catalog.
- 企業：ケイツー
- 価格：Other
